When operating a Fuse 1 generation printer, it is normal for powder to accumulate at the bottom of the print chamber. If an abnormally large amount of powder builds up during a single print, it may indicate that there is a leak somewhere in the machine.

Causes

• Powder leaking through one or more seals in the build chamber

Troubleshooting steps

1. Clean or replace build chamber seals as indicated on the Maintenance screen on the printer touchscreen or in the support article Maintaining the build chamber.
2. If the leak persists after replacing seals or the seals were clean and undamaged, inspect the print bed felt seal for damage, particularly if you see voids around the edge of the powder cake.
   1. Follow the instructions in Replacing the Fuse 1 generation print bed to remove the print bed.
   2. Vacuum the felt seal around the edge of the print bed, then inspect it for compacted powder or other damage.
   3. If the print bed is damaged, replace it. The print bed for Fuse 1 generation build chambers is available for purchase on the Formlabs Store.
3. If the leak persists, contact Formlabs Support or your certified service provider.

Causes

• Powder leaking around doser seal (hopper-side powder accumulation only)
• Powder leaking from powder trough (either hopper or buffer-side)
• Mechanical issue with recoater

Troubleshooting steps

1. Small piles of powder isolated in the corners of the floor are unlikely to impact printer performance. There is no repair that is guaranteed to eliminate these small leaks.
2. If there is a large pile of powder on either side of the floor, the recoater mechanism is failing.
1. If the recoater mechanism is failing, the printer would likely have shown Error 94/3 or Error 93/1 around when the leak was discovered. If so, follow the applicable troubleshooting steps in this article.
3. Contact Formlabs Support or your certified service provider with pictures of the powder accumulation for an evaluation of the severity and root cause of the leak and its impact on print performance.